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| 23-30 GHz Low Noise Amplifier AA028N1-99 Features I 3 dB Noise Figure I 18 dB Gain I +9 dBm Output Power I Rugged, Reliable Package I Single Voltage Operation I 100% RF and DC Testing 0.022 (0.56 mm) 0.180 (4.57 mm) 0.090 (2.29 mm) 0.295 (7.49 mm) 0.225 (5.72 mm) 0.011 (0.28 mm) AA028N1-99 YYWW PIN 1 INDICATOR 0.008 (0.20 mm) Description The AA028N1-99 is a broadband millimeterwave amplifier in a rugged package. The amplifier is designed for use in millimeterwave communication and sensor systems as the receiver front-end or transmitter gain stage when high gain, wide dynamic range, and low noise figure are required. The robust ceramic and metal package provides excellent electrical performance, excellent thermal performance, and a high degree of environmental protection for long-term reliability. A single supply voltage simplifies bias requirements. All amplifiers are screened at the operating frequencies prior to shipment for guaranteed performance. Amplifier is targeted for millimeterwave point-to-point and point-to-multipoint wireless communications systems. 0.028 (0.71 mm) 0.057 (1.45 mm) Block Diagram LNA Electrical Specifications at 25C (VD1 = VD2 = +5.5 V) RF Parameter Bandwidth Small Signal Gain Noise Figure Input Return Loss Output Return Loss Output Power at 1 dB Gain Compression Temperature Coefficient of Gain Symbol BW G NF RLI RLO P1 dB dG/dT 6 Min. 23 15 Typ. 22-31 18 2.9 11 13 9 -0.016 3.5 Max. 30 Unit GHz dB dB dB dB dBm dB/C DC Parameter Drain Current 1 Drain Current 2 Total Drain Current Symbol ID1 ID2 ID1 + ID2 Min. Typ. 20 22 42 60 Max. Unit mA mA mA Alpha Industries, Inc. [781] 935-5150 * Fax [617] 824-4579 * Email sales@alphaind.com * www.alphaind.com Specifications subject to change without notice. 10/99A 1 23-30 GHz Low Noise Amplifier AA028N1-99 Typical Performance Data 30 0 S11 -55C 25C Return Loss (dB) Gain (dB) 20 90C 10 -10 S22 -20 0 15 20 25 30 35 -30 15 20 25 30 35 Frequency (GHz) Frequency (GHz) Gain vs. Frequency 6 Return Loss vs. Frequency Absolute Maximum Ratings Characteristic Value -55C to +90C -65C to +150C 6 VDC 6 VDC 13 dBm Operating Temperature (TOP) Storage Temperature (TST) Bias Voltage (VD1) Bias Voltage (VD2) Power In (PIN) 5 NF (dB) 4 3 2 20 25 30 35 Pin Out N/C VD2 Frequency (GHz) Noise Figure vs. Frequency RF In RF Out N/C PIN 1 INDICATOR VD1 2 Alpha Industries, Inc. [781] 935-5150 * Fax [617] 824-4579 * Email sales@alphaind.com * www.alphaind.com Specifications subject to change without notice. 10/99A 23-30 GHz Low Noise Amplifier AA028N1-99 Typical S-Parameters Frequency (GHz) 10.0 15.0 16.0 17.0 18.0 19.0 20.0 21.0 22.0 23.0 24.0 25.0 26.0 27.0 28.0 29.0 30.0 31.0 32.0 33.0 34.0 35.0 36.0 37.0 38.0 40.0 S11 Mag. (dB) -0.7 -0.4 -0.5 -0.7 -0.9 -1.3 -2.3 -4.2 -7.9 -12.5 -13.5 -13.0 -14.0 -16.8 -21.2 -16.1 -11.3 -7.5 -5.6 -4.5 -3.6 -3.3 -3.0 -2.8 -2.7 -2.7 Ang. (Deg.) 57.5 -62.4 -82.8 -102.1 -121.1 -141.8 -164.2 172.5 153.1 158.2 174.4 170.7 161.8 154.2 176.8 -142.2 -151.7 -171.8 157.7 130.2 100.1 69.5 42.6 15.3 -8.1 -47.9 Mag. (dB) -44.8 8.0 10.6 12.2 13.5 15.1 16.8 18.5 19.5 19.6 19.3 19.0 18.8 18.7 18.6 18.5 18.4 18.0 17.4 16.6 15.7 14.4 12.9 11.2 9.4 5.9 S21 Ang. (Deg.) -23.1 100.9 40.9 -14.1 -63.1 -109.4 -156.5 153.5 100.8 50.4 3.1 -40.3 -81.6 -122.4 -162.9 156.1 114.5 73.1 30.7 -10.3 -50.9 -91.0 -129.0 -165.5 160.2 97.3 Mag. (dB) -50.5 -45.7 -47.1 -46.0 -46.5 -48.5 -45.6 -43.1 -39.7 -38.4 -37.7 -37.3 -38.1 -39.2 -41.3 -44.1 -46.5 -39.7 -37.6 -35.0 -35.2 -36.0 -35.4 -37.7 -39.9 -52.3 S12 Ang. (Deg.) -67.8 -93.0 -87.3 -92.0 -92.9 -72.8 -55.3 -52.4 -54.3 -71.5 -82.2 -91.2 -99.0 -107.0 -109.3 -101.9 -65.4 -50.4 -62.4 -72.6 -92.9 -107.7 -108.3 -125.9 -123.7 162.1 Mag. (dB) -0.7 -1.9 -3.2 -4.4 -5.0 -5.4 -6.0 -7.2 -9.3 -11.6 -14.9 -18.7 -22.4 -20.4 -15.5 -11.2 -9.6 -7.8 -7.5 -7.2 -7.0 -7.3 -6.9 -6.7 -6.4 -5.7 S22 Ang. (Deg.) 92.4 -73.7 -97.4 -113.4 -126.6 -141.9 -157.7 -174.9 170.3 158.5 153.2 153.5 -172.2 -139.0 -129.0 -145.8 -166.5 173.3 145.1 121.0 91.3 62.4 35.9 9.8 -12.4 -52.5 Alpha Industries, Inc. [781] 935-5150 * Fax [617] 824-4579 * Email sales@alphaind.com * www.alphaind.com Specifications subject to change without notice. 10/99A 3 23-30 GHz Low Noise Amplifier AA028N1-99 Co-Planar Millimeterwave Package Handling/Mounting Co-planar packages (Figure 1) require careful mounting design to maintain optimal performance and to minimize VSWR interactions. A connection to the ground pads on either side of the RF line is optional and will depend on the type of material and geometry of the interface at the RF ports. RF/DC Bondwire Attachment Standard thermosonic ball or ribbon attachment is used to make the connections to the RF and DC interfaces. When designing the layout, be aware that most bonding machines have a limited reach and may require special tooling to wire/ribbon bond in center of a large circuit. Handling In general the co-planar ceramic package is quite rugged. However, due to ceramic's brittle nature one should exercise care when handling with metal tools. Do not apply heavy pressure to the lid. Vacuum tools may be used to pick and place this part. The Cu-Mo-Cu base of this package is very durable, however, care should be exercised when attaching with screw hardware on packages which come with screw holes. Over-tightening of screws could deform the base, which could cause cracks in the ceramic walls. Only personnel trained in both ESD precautions, and handling precautions should be allowed to handle these packages. RF In RF Out RF In RF Out Figure 1. Co-Planar Packages Package Launch Microstrip Mounting An example of a co-planar microstrip launch is illustrated in Figure 2 using an equal height dielectric material. A hole is cut into the circuit board to allow the package to be mounted directly to the circuit ground plane. The hole should be cut as close to the outer dimensions of the package to minimize RF gap distances. It is preferred to match (mirror) the geometry of the package interface to achieve best results. Three 5 x 1/4 mil ribbon bonds will complete the connection providing a minimum discontinuity connection. Multiple bondwires are also acceptable. Circuit Board Figure 2. Microstrip Mount Surface Mounting Mounting of the package to the surface (Figure 3) of a circuit can be accomplished by using a series of via holes to provide ground for the package. Although, this method is not preferred it can be done if careful design practices are used. Via spacing and size may have a strong effect on high frequency performance of the package. Package Circuit Board Package Attachment The package can be conductive epoxy attached to its mounting surface using either a paste or film media. SnPb eutectic attachment can also be used in situations were heat removal is important. Some packages allow for hardware mounting. Care should be taken to ensure good ground contact is maintained. 4 Figure 3. Surface Mount Alpha Industries, Inc. [781] 935-5150 * Fax [617] 824-4579 * Email sales@alphaind.com * www.alphaind.com Specifications subject to change without notice. 10/99A |
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